Fangliang Dong

Biography

Fangliang holds a Ph.D. degree in electrical engineering from Shanghai Jiao Tong University, China, and now is working in Magnet Technology Division, Francis Bitter Magnet Laboratory, Plasma Science and Fusion Center.

 

Education

Shanghai Jiao Tong University, Shanghai, China, Ph.D, 2016-2021

 

Awards & honors

International Mathematical Contest in Modeling - Outstanding Winner (The Top Prize)

SIAM (Society for Industrial and Applied Mathematics) Award

 

Work experience

Postdoctoral Fellow in the PSFC, Jan. 2022 to now.

 

Research

His work is focused on

 

1. Low- and high-temperature superconducting magnet technology (stability and protection; magnet manufacturing; cryogenic engineering);

2. NMR and MRI superconducting magnets;

3. Theory of Superconductivity;

4. Superconducting Electrical Machinery;

5. Liquid-helium-free superconducting magnets;

6. Solid cryogens as thermal mass enhancers.

Interested cooperation directions: practical applications of high-temperature superconductivity, high-power density linear motor, nuclear magnetic resonances, etc.

Publications

Selected peer-reviewed papers:

Dong, F. L. et al. An on-board 2G HTS magnets system with cooling-power-free and persistent-current operation for ultrahigh speed superconducting maglevs. Sci Rep-Uk 9 (2019).

 

Dong, F. L. et al. Improvement of magnetic and cryogenic energy preservation performances in a feeding-power-free superconducting magnet system for maglevs. Energy 190 (2020).

 

Dong, F. L. et al. Design and Analysis of a Small-Scale Linear Propulsion System for Maglev Applications (2)-The HTS No-Insulation Magnets. IEEE T Appl Supercon 29 (2019).

 

Dong, F. L. et al. R&D of No-Insulation HTS Magnets Using 2G Wires in a Prototype for Maglev Applications. IEEE T Appl Supercon 29 (2019).

 

Dong, F. L. et al. An Overcurrent Controlled HTS Persistent Current Switch Without Any Additional Switching Triggers. IEEE T Appl Supercon 29 (2018).

 

Dong, F. L. et al. Studies on the features of characteristic resistance of a no-insulation superconducting coil in energizing and de-energizing processes. Physica C 551, 33-40 (2018).

 

Dong, F. L. et al. Method and Process of Mechanical Evaluation of a 2G HTS Magnet System for Maglev Applications. IEEE T Appl Supercon 30 (2020).

 

Huang, Z. et al. Comparison of Long Stator Three-Phase Winding Structures in a 2G HTS LSM for Maglev Application. IEEE T Appl Supercon 31 (2021).

 

Huang, Z. et al. Evaluation of the Structural Dynamics of a 2G HTS Magnet System Considering Electromagnetic and Thermal Stress. IEEE T Appl Supercon 31 (2021).

 

Hao, L. N., Huang, Z., Dong, F. L., Qiu, D. R. & Jin, Z. J. Performance Comparison and Applicability Analysis of Different Armature Structures for a Small-Scale HTS Linear Synchronous Motor. IEEE T Appl Supercon 29 (2019).

 

Hao, L. N., Huang, Z., Dong, F. L., Qiu, D. R. & Jin, Z. J. A Novel Hybrid Magnet Made of HTS Tape Stacks and Permanent Magnets for Motor Applications. IEEE T Appl Supercon 29 (2019).

 

Hao, L. N. et al. Study on Electrodynamic Suspension System with High-Temperature Superconducting Magnets for a High-Speed Maglev Train. IEEE T Appl Supercon 29 (2019).

 

Teng, X. Y. et al. Design and Key Performance of 2G HTS Coils for High Speed Superconducting Maglev Application. IEEE T Appl Supercon 31 (2021).

 

Pan, Y. H. et al. Investigation on Current Distribution and Joint Resistance-Overlap Length Relationship for Non-Superconducting Joints. IEEE T Appl Supercon 29 (2019).

 

Wang, M. Y. et al. Performance Study on the No-Insulation HTS Coil Wound With Narrow-Stacked Wire. IEEE T Appl Supercon 30 (2020).

 

Wang, M. Y. et al. Study on the Screening Current Induced Field of a Novel Narrow HTS Tape with 1 mm Width. IEEE T Appl Supercon 29 (2019).

 

Pan, Y. H. et al. An equivalent homogenized model for non-superconducting joints made by ReBCO coated conductors. Supercond Sci Tech 31 (2018).

 

Wang, M. Y. et al. Three-Dimensional Numerical Study on Transport AC Loss of Soldered-Stacked-Square-Twisted (3S-T) Wire. IEEE T Appl Supercon 29 (2019).